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SPIE: The International Society for Optical Engineering

Smart Systems for Bridges, Structures, and Highways (ss05)

Part of SPIE's 9th Annual International Symposium on Smart Structures and Materials
17-21 March 2002
Town and Country Resort & Convention Center, San Diego, California USA

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Conference chairs, cochairs, and program committee

Smart materials and structures technology represents an emerging field of study that is finding many applications in support of civil infrastructure systems. These applications include structural control, condition/health monitoring, damage assessment, structural repair, integrity assessment and more recently in asset management, preservation, and operation of civil infrastructure. The potential benefit of this technology may be improved system reliability, longevity, enhanced system performance, improved safety against natural hazards and vibrations, and a reduction in life-cycle costs in operating and managing civil infrastructure systems. Thus, many researchers in academia, government laboratories, and industry are making progress in advancing the state-of-the-art of the technology with respect to improving the performance, management, and operation of civil infrastructure systems. This conference attempts to bring together experts in this emerging cross-disciplinary field to discuss recent advances. Papers are solicited in all areas which address either analysis, development, performance, or application of smart materials, and structures technology to civil infrastructure systems. Application areas of interest include buildings, bridges, highways, and other civil infrastructure systems. Specifically, papers are solicited in the following areas:

New Technological Advances:

Advanced Signal Processing Techniques and Software Systems

Design, Engineering, and Implementation:

Interaction and Transduction Phenomena:

Integration of Smart Systems:

Implementation and Demonstration of Advanced Technologies on Civil Infrastructure:

Abstracts and papers submitted MUST show an explicit connection to smart structures and materials in both the abstract and the main text in order to be considered. This connection can be either direct (the technique would be used directly in a smart structure) or indirect (the technique can be used to help create something that would be used directly in a smart structure).


Submission of Abstracts for Smart Structure and Materials symposium

Abstract Due Date: 20 August 2001 
Manuscript Due Date: 18 February 2002 
Final Summary Due Date: 14 January 2002

Submissions imply the intent of at least one author to register, attend the symposium, and present the paper (either orally or in poster format).


Abstract Format

Your abstract should include all of the following:

  1. SUBMIT TO: ss05, LIU
  2. SUBMIT EACH ABSTRACT TO ONE CONFERENCE ONLY Smart Systems for Bridges, Structures, and
    Highways (ss05)
  4. AUTHOR LISTING (principal author first). For all authors: First (given) name (initials not acceptable), Last (family) name, Affiliation, Mailing address, Telephone, Fax, and Email address.
    Indicate your preference for "Oral Presentation" or "Poster Presentation." Final placement is subject to chairs’ discretion.
  6. ABSTRACT TEXT Approximately 250 words.
  7. KEYWORDS List a maximum of five keywords.
  8. BRIEF BIOGRAPHY ( principal/presenting author) Approximately 50 words.


Conditions of Acceptance


Paper Preview

To ensure a high-quality conference, all abstracts and Proceedings of SPIE papers will be reviewed by the Conference Chairs for technical merit and content.


Instructions for Submitting Abstracts

Smart Structures and Materials
SPIE, P.O. Box 10, Bellingham, WA 98227-0010 U.S.A.
Shipping Address: 1000 20th St., Bellingham, WA 98225 U.S.A.


Publishing Policy

Manuscript due dates must be strictly observed. Whether the conference volume will be published before or after the meeting, late manuscripts run the risk of not being published in the Proceedings of SPIE. The objective of this policy is to better serve the conference participants and the technical community at large. Your coorperation is appreciated by all.


Final Summary

Accepted authors will receive instructions for submission of the 200-word Final Summary in their author kit. The Final Summaries will be published and available at the meeting.


Oral or Poster Presentation

Instructions for Oral and Poster presentations will be included in your author kit. All Oral and Poster presentations are included in the Proceedings of SPIE and require a manuscript.


Proceedings of SPIE

These conferences will result in full-manuscript editor-reviewed volumes published in the Proceedings of SPIE that can be ordered through the Advance Technical Program. Camera-ready manuscripts are requir3ed of all accepted applicants and must be submitted in English by 18 February 2002. Copyright to the manuscript is expected to be released for publication in the Proceedings of SPIE. Note: If an author does not attend the meeting and make a presentation , the chair may choose not to publish the author's manuscript in the conference volume. Papers published are indexed in leading scientific databases including INSPEC, Compendex Plus, Physics Abstracts, Chemical Abstracts, International Aerospace Abstracts, and Index to Scientific and Technical Proceedings. 


Participant Registration Fee

Authors, coauthors, program committee members, and session chairs are accorded a reduced symposium registration fee. If you are a current SPIE Member you will enjoy an additional discount on our symposium registration fee and on educational short courses.


Conference Committee


Conference Cochairs

Program Committee:


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