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Smart Systems for Bridges, Structures, and Highways (ss05)
Part of SPIE's 9th Annual International Symposium on Smart Structures and Materials
17-21 March 2002
Town and Country Resort & Convention Center, San Diego, California USA
Conference chairs, cochairs, and program committee
Smart materials and structures technology represents an emerging field of study that is finding many applications in support of civil infrastructure systems. These applications include structural control, condition/health monitoring, damage assessment, structural repair, integrity assessment and more recently in asset management, preservation, and operation of civil infrastructure. The potential benefit of this technology may be improved system reliability, longevity, enhanced system performance, improved safety against natural hazards and vibrations, and a reduction in life-cycle costs in operating and managing civil infrastructure systems. Thus, many researchers in academia, government laboratories, and industry are making progress in advancing the state-of-the-art of the technology with respect to improving the performance, management, and operation of civil infrastructure systems. This conference attempts to bring together experts in this emerging cross-disciplinary field to discuss recent advances. Papers are solicited in all areas which address either analysis, development, performance, or application of smart materials, and structures technology to civil infrastructure systems. Application areas of interest include buildings, bridges, highways, and other civil infrastructure systems. Specifically, papers are solicited in the following areas:
New Technological Advances:
- smart devices (sensors, actuators, dampers, fuses, etc.)
- tetherless or wireless systems
- data systems
- monitoring systems
- diagnostic systems
- supervisory control systems
- active control systems
- information technology for civil infrastructure
- data management of smart civil systems
- data mining for smart civil systems
Advanced Signal Processing Techniques and Software Systems
- internet-based real-time data systems
- autonomous real-time processing and analysis capabilities
- online diagnostics
- software and hardware systems
- open architecture compatible configurations
- advances in system ID, modeling, and Simulation.
Design, Engineering, and Implementation:
- design/characterization/creation of multifunctional systems
- special smart components, devices and, sub-assemblies
- smart systems for evaluation, detection, monitoring, and control
- novel materials for sensing and actuation, and design
Interaction and Transduction Phenomena:
- civil infrastructure (buildings, highways, bridges, lifelines, etc.)
- mechanical systems
- aerospace systems
Integration of Smart Systems:
Implementation and Demonstration of Advanced Technologies on Civil Infrastructure:
- integrated asset management
- operational management
- small scale and large scale demonstrations.
Abstracts and papers submitted MUST show an explicit connection to smart structures and materials in both the abstract and the main text in order to be considered. This connection can be either direct (the technique would be used directly in a smart structure) or indirect (the technique can be used to help create something that would be used directly in a smart structure).
Submission of Abstracts for Smart Structure and Materials symposium
Abstract Due Date: 20 August 2001
Manuscript Due Date: 18 February 2002
Final Summary Due Date: 14 January 2002
Submissions imply the intent of at least one author to register, attend the symposium, and present the paper (either orally or in poster format).
Your abstract should include all of the following:
- SUBMIT TO: ss05, LIU
- SUBMIT EACH ABSTRACT TO ONE CONFERENCE ONLY Smart Systems for Bridges, Structures, and
- ABSTRACT TITLE
- AUTHOR LISTING (principal author first). For all authors: First (given) name (initials not acceptable), Last (family) name, Affiliation, Mailing address, Telephone, Fax, and Email address.
Indicate your preference for "Oral Presentation" or "Poster Presentation." Final placement is subject to chairs’ discretion.
- ABSTRACT TEXT Approximately 250 words.
- KEYWORDS List a maximum of five keywords.
- BRIEF BIOGRAPHY ( principal/presenting author) Approximately 50 words.
Conditions of Acceptance
- Authors are expected to secure registration fees and travel and accommodation funding, independent of SPIE, through their sponsoring organizations before submitting abstracts.
- Only original material should be submitted.
- Commercial papers, descriptions of papers with no research/development content, and papers where supporting data or a technical description cannot be given for proprietary reasons will not be accepted for presentation in this symposium.
- Abstracts should contain enough detail to clearly convey the approach and the results of the research.
- Government and company clearance to present and publish should be final at the time of submittal.
- Applicants will be notified of acceptance by mail no later than 23 December 2001. Early notification of acceptance will be placed on the SPIE Web site at the week of 18 November 2001 at http://www.spie.org/info/ss.
To ensure a high-quality conference, all abstracts and Proceedings of SPIE papers will be reviewed by the Conference Chairs for technical merit and content.
Instructions for Submitting Abstracts
- All authors are STRONGLY ENCOURAGED to submit their abstracts by the due date using the "Submit an Abstract" link on the Web at: http://www.spie.org/info/ss. Using this method of submission ensures that your abstract will be immediately accessible to the conference chair for review. Using other methods of submission (listed below) will delay the processing of your abstract.
- or E-MAIL each abstract separately to: email@example.com in ACCII text (not encoded) format. IMPORTANT: to ensure receipt and proper processing of your abstract, the Subject line must include only the following: SUBJECT: SS05, LIU
- or MAIL your abstract to:
Smart Structures and Materials
SPIE, P.O. Box 10, Bellingham, WA 98227-0010 U.S.A.
Shipping Address: 1000 20th St., Bellingham, WA 98225 U.S.A.
- or FAX one copy to SPIE at (360) 647-1445 (Send each abstract separately).
Manuscript due dates must be strictly observed. Whether the conference volume will be published before or after the meeting, late manuscripts run the risk of not being published in the Proceedings of SPIE. The objective of this policy is to better serve the conference participants and the technical community at large. Your coorperation is appreciated by all.
Accepted authors will receive instructions for submission of the 200-word Final Summary in their author kit. The Final Summaries will be published and available at the meeting.
Oral or Poster Presentation
Instructions for Oral and Poster presentations will be included in your author kit. All Oral and Poster presentations are included in the Proceedings of SPIE and require a manuscript.
Proceedings of SPIE
These conferences will result in full-manuscript editor-reviewed volumes published in the Proceedings of SPIE that can be ordered through the Advance Technical Program. Camera-ready manuscripts are requir3ed of all accepted applicants and must be submitted in English by 18 February 2002. Copyright to the manuscript is expected to be released for publication in the Proceedings of SPIE. Note: If an author does not attend the meeting and make a presentation , the chair may choose not to publish the author's manuscript in the conference volume. Papers published are indexed in leading scientific databases including INSPEC, Compendex Plus, Physics Abstracts, Chemical Abstracts, International Aerospace Abstracts, and Index to Scientific and Technical Proceedings.
Participant Registration Fee
Authors, coauthors, program committee members, and session chairs are accorded a reduced symposium registration fee. If you are a current SPIE Member you will enjoy an additional discount on our symposium registration fee and on educational short courses.
- S. C. Liu, National Science Foundation
- Darryll J. Pines, University of Maryland/College Park
- Janming Ko, Hong Kong Polytechnic Univ. (Hong Kong)
- A. Emin Aktan, Drexel Univ.
- Steven B. Chase, Federal Highway Administration.
- Makola M. Abdullah, Florida A&M Univ. and Florida State Univ.
- Thomas Baca, Applied Technology Associates
- Fabio Casciati, Univ. Degli Studi di Pavia (Italy)
- Reginald DesRoches, Georgia Institute of Technology
- Shirley J. Dyke, Washington Univ.
- Charles R. Farrar, Los Alamos National Lab.
- Maria Q. Feng, Univ. of California/Irvine
- Alison B. Flatau, National Science Foundation
- Dan M. Frangopol, Univ. of Colorado/Boulder
- Toshiaki Fujimori, Shimizu Corp. (Japan)
- Yozo Fujino, Univ. of Tokyo (Japan)
- Gabriel V. Garcia, New Mexico State Univ.
- Henri P. Gavin, Duke Univ.
- Dryver R. Huston, Univ. of Vermont
- Sami F. Masri, Univ. of Southern California
- Isao Nishimura, Musashi Institute of Technology (Japan)
- Shunsuke Otani, Univ. of Tokyo (Japan)
- James Roberts, CalTrans
- Peter Schwesinger, Bauhaus-Univ. Weimar (Germany)
- Charles S. Sikorsky, Caltrans
- Mete A. Sozen, Purdue Univ.
- Billie F. Spencer, Jr., Univ. of Notre Dame
- Nobuo Takeda, Univ. of Tokyo (Japan)
- Kenzo Tokeo, Kyoto Univ. (Japan)
- Ming L. Wang, Univ. of Illinois/Chicago
- Glenn A. Washer, Federal Highway Administration
- Norman M. Wereley, Univ. of Maryland/College Park
- Sharon Wood, Univ. of Texas/Austin
- Bojidar Yanev, New York City DOT
- Kazuo Yoshida, Keio Univ. (Japan)