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Road vehicle-induced vibration control of microelectronics facilities

Guo Anxin (郭安薪)1,2, Xu Youlin (徐幼麟)1 and Li Hui (李惠)2

  1. Department of Civil and Structural Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong, China
  2. School of Civil Engineering, Harbin Institute of Technology, Harbin, China

Abstract: A hybrid control platform is investigated in this paper to mitigate microvibrations to a group of vibration-sensitive equipment installed in a microelectronics facility subject to nearby road vehicle-induced horizontal and vertical ground motions. The hybrid control platform, on which microelectronics equipment is installed, is mounted on a building floor through a series of passive mounts and controlled by hydraulic actuators in both horizontal and vertical directions. The control platform is an elastic body with significant bending modes of vibration, and a sub-optimal control algorithm is used to manipulate the hydraulic actuators with actuator dynamics included. The finite element model and the equations of motion of the coupled platform-building system are then established in the absolute coordinate to facilitate the feedback control and performance evaluation of the platform. The horizontal and vertical ground vibrations at the base of the building induced by nearby moving road vehicles are assumed to be stationary random processes. A typical three-story microelectronics building is selected as a case study. The case study shows that the vertical vibration of the microelectronics building is higher than the horizontal. The use of a hybrid control platform can effectively reduce both horizontal and vertical microvibrations of the microelectronics equipment to the level which satisfies the stringent microscale velocity requirement specified in the Bolt Beranek & Newman (BBN) criteria.

Keywords: microelectronics facility; microvibration; hybrid control platform; road vehicles; horizontal ground motion; vertical ground motion

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Copyright 2009 IEM. Journal of Earthquake Engineering and Engineering Vibration. All Rights Reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, scanning or otherwise, except as described below, without written permission from the Publisher. Copying of articles is not permitted except for personal and internal use, to the extent permitted by national copyright law, or under the terms of a license issued by the National Reproduction Rights Organization of China.